IBM's silicon photonics technology ready to speed up cloud and Big Data applications

Home 3D Integration Wafer Level Packaging Materials and Equipment
In this issue: • IBM's silicon photonics technology ready to speed up cloud and Big Data applications • 3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market • Process Watch: Time is the enemy of profitability • Moore's Law to keep on 28nm • UMC unveils UMC Auto Platform to enable automotive IC designs • GaN Systems power transistors are 50% smaller • Dow Corning introduces next-generation thermal interface material • Advantest develops semiconductor circuit analysis terahertz technology • The ConFab - Semi industry is now mature • SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings • Samtec joins IRT Nanoelec Silicon Photonics Program • Six top 20 semiconductor suppliers show >20% growth • First quarter silicon wafer shipments reach record levels	Share:
Top News IBM's silicon photonics technology ready to speed up cloud and Big Data applications IBM announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.  Share:    3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies. Share:    Process Watch: Time is the enemy of profitability There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases. Share:    Moore's Law to keep on 28nm Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm. Share:
From our Sponsor Semiconductor Device Fault Isolation The Optotherm Sentris Thermal Emission Microscope detects shorts, latch-ups, gate-oxide breakdown, and leakage current. Detect hot spots below 0.001°C. Lock-in Thermography pinpoints faults on bare/packaged devices. No surface coating is required. We offer a no-cost thermal test/evaluation of your device via web conference.  Click here for more information
Tech News UMC unveils UMC Auto Platform to enable automotive IC designs United Microelectronics Corporation, a global semiconductor foundry, unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications. Share:    GaN Systems power transistors are 50% smaller GaN Systems, a developer of gallium nitride power switching semiconductors, confirmed the world's smallest 650V, 15A gallium nitride transistor.  Share:    Dow Corning introduces next-generation thermal interface material Dow Corning unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material. Share:    Advantest develops semiconductor circuit analysis terahertz technology Semiconductor test equipment supplier Advantest Corporation announced that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits. Share:    The ConFab - Semi industry is now mature The Confab started on Tuesday last week, an industry get-together organised by Solid State Technology (part of Extension Media). Share:
Business News SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month. Share:    Samtec joins IRT Nanoelec Silicon Photonics Program Samtec, Inc. announced its entrance in the Silicon Photonics Program of the IRT Nanoelec. Share:    Six top 20 semiconductor suppliers show >20% growth SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking. Share:    First quarter silicon wafer shipments reach record levels Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Share:
Web Editor Shannon Davis 603-547-5309 sdavis@extensionmedia.com Subscription Information SST invites you to forward this newsletter to colleagues or associates who might be interested in our weekly news summaries. You may also contact us to by clicking here or you can write to us at: Extension Media 1786 18th Street San Francisco, CA 94107 USA