SEMI reports 2014

Home 3D Integration Wafer Level Packaging Materials and Equipment
In this issue: • Consider packaging requirements at the beginning, not the end, of the design cycle • Imaging tomorrow's components, acoustically • Supplier Hub answers the needs of a changing semiconductor industry • Samsung's finFETs ARE in the Galaxy S6! • Micron and Intel unveil new 3D NAND flash memory • TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts • Insights from the Leading Edge: KNS update on thermocompression bonding • Apple Watch launch confirms WiFi and NFC inside • SEMI reports 2014 global semiconductor materials sales of $44.3B • IDT appoints semiconductor veteran Robert A. Rango to Board of Directors • 2014: A year in review - Semiconductor equipment and materials market and outlook • Cavendish Kinetics adopts STATS ChipPAC's wafer level technology for its SmarTune RF MEMS tuners	Share:
Top News Consider packaging requirements at the beginning, not the end, of the design cycleConsider these eight issues where the packaging team should be closely involved with the circuit design team.Share:    Imaging tomorrow's components, acousticallyPackages are changing. Acoustic methods provide a way to image and analyze them.Share:    Supplier Hub answers the needs of a changing semiconductor industrySupplier Hub answers the needs of a changing semiconductor industry.Share:    Samsung's finFETs ARE in the Galaxy S6!The much-anticipated Samsung Galaxy S6 made an early appearance in our teardown labs last week, thanks to the diligent skills of our trusted logistics guru.Share:
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Tech News Micron and Intel unveil new 3D NAND flash memoryMicron Technology, Inc. and Intel Corporation revealed the availability of their 3D NAND technology, the world's highest-density flash memory.Share:    TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design startsThis certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements. Share:    Insights from the Leading Edge: KNS update on thermocompression bondingContinuing our look at the 2015 IMAPS Device Packaging Conference.Share:    Apple Watch launch confirms WiFi and NFC insideToday (April 10) is the day that the Apple Watch becomes available for order, and of course we will be buying some to see what's inside.Share:

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Business News SEMI reports 2014 global semiconductor materials sales of $44.3BThe global semiconductor materials market increased 3 percent in 2014 compared to 2013 while worldwide semiconductor revenues increased 10 percent.Share:    IDT appoints semiconductor veteran Robert A. Rango to Board of DirectorsIntegrated Device Technology, Inc. announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT's Board of Directors, effective April 6, 2015.Share:    2014: A year in review - Semiconductor equipment and materials market and outlook 2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.Share:    Cavendish Kinetics adopts STATS ChipPAC's wafer level technology for its SmarTune RF MEMS tunersSTATS ChipPAC Ltd. announced that Cavendish Kinetics, a provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technologyShare:

Web Editor Shannon Davis 603-547-5309 sdavis@extensionmedia.com