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In this issue: • NXP-Freescale merger to result in world's eighth largest chip maker • Advanced analytics for yield improvement and zero defect in semiconductors • Process Watch: Know your enemy • Poised for more growth • Micron and Intel unveil new 3D NAND flash memory • Pibond introduces a new product line for logic, memory, power and MEMS devices • Solving molybdenum disulfide's 'thin' problem • Chemists make new silicon-based nanomaterials • AWSC purchases ClassOne's Solstice S8 electroplater • U.S.-headquartered companies capture bulk of IDM, fabless IC sales • Southeast Asia to spend $19B for semiconductor equipment and materials by 2016 • NXP-Freescale fusion creates automotive semiconductor powerhouse, IHS Says • Thin wafer processing temporary bonding adhesive film for 3D wafer integration	Share:
Top stories NXP-Freescale merger to result in world's eighth largest chip maker The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world's eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.Share:    Advanced analytics for yield improvement and zero defect in semiconductorsMachine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.Share:    Process Watch: Know your enemyAnything that degrades the quality of the measurement also degrades the quality of the process because it introduces more variability into the Statistical Process Control (SPC) charts which are windows into the health of the process.Share:    Poised for more growthStrong fab equipment spending expected in 2015; Slower but positive 2016.Share:
Tech News Micron and Intel unveil new 3D NAND flash memoryMicron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory.Share:    Pibond introduces a new product line for logic, memory, power and MEMS devicesTargeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing. Share:    Solving molybdenum disulfide's 'thin' problemResearch team increases material's light emission by twelve times.Share:    Chemists make new silicon-based nanomaterialsChemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound. Share:
Business News AWSC purchases ClassOne's Solstice S8 electroplaterSemiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan. Share:    U.S.-headquartered companies capture bulk of IDM, fabless IC salesRecent acquisitions expeted to boost Europe's share in coming years.Share:    Southeast Asia to spend $19B for semiconductor equipment and materials by 2016Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang. Share:    NXP-Freescale fusion creates automotive semiconductor powerhouse, IHS SaysThe merged company would become the leading supplier of semiconductors to the automotive market, with at least $1 billion more revenue than the next-largest supplier, Renesas.Share:
Product News Thin wafer processing temporary bonding adhesive film for 3D wafer integrationAI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer.Share:
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