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In this issue: • 3D ASIP: "It's Complicated" • Global semiconductor sales increase in October; Substantial growth projected for 2014 • Cypress and Spansion to merge in $4B all-stock transaction • Soitec announces new world record for solar cell efficiency at 46% • Chipworks: IEDM 2014 • Stacking 2-dimensional materials may lower cost of semiconductor devices • Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor • Entegris launches next generation of 450mm wafer carriers • Murata completes acquisition of Peregrine Semiconductor • Global Semiconductor Alliance announces 2014 Award recipients • John Neuffer named president and CEO of SIA • Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors	Share:
Top stories 3D ASIP: "It's Complicated" The presentations at this week's 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status. (From SemiMD) Share:    Global semiconductor sales increase in October; Substantial growth projected for 2014 The Semiconductor Industry Association announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total. Share:    Cypress and Spansion to merge in $4B all-stock transaction Cypress Semiconductor Corp. and Spansion, Inc. announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.  Share:    Soitec announces new world record for solar cell efficiency at 46% The record multi-junction solar cell converts 46% of the solar light into electrical energy.  Share:
Tech News Chipworks: IEDM 2014 Later this month, the good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2014 IEEE International Electron Devices Meeting. Share:    Stacking 2-dimensional materials may lower cost of semiconductor devices A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs. Share:    Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor Holst Centre, imec and their partner Evonik have realized a general-purpose 8-bit microprocessor, manufactured using complementary thin-film transistors (TFTs) processed at temperatures compatible with plastic foil substrates.  Share:    Entegris launches next generation of 450mm wafer carriers Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers. Share:
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Business News Murata completes acquisition of Peregrine Semiconductor Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, announced that Murata has acquired all outstanding shares of Peregrine.  Share:    Global Semiconductor Alliance announces 2014 Award recipients GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry's most respected companies for its products, vision and future opportunities.  Share:    John Neuffer named president and CEO of SIA The Semiconductor Industry Association announced that John Neuffer has been named president & CEO of the association. Share:    Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors Lattice Semiconductor Corporation announced that its Board of Directors has appointed Jeff Richardson to the company's Board of Directors and Audit Committee. Share:
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