Present your Ideas at The 10th Annual ConFab
SUBMIT YOUR ABSTRACT TODAY – Submission Deadline is November 22nd! | | If you’re an executive at a semiconductor manufacturing company and would like to present at The ConFab and participate in three days of productive meetings and roundtable discussions, we’d like to hear from you. The ConFab will be held from June 22–25, 2014 at The Encore at The Wynn in Las Vegas (see www.theconfab.com for more information).
We’re presently recruiting speakers and panelists interested in speaking on the following topics:
• Economic outlook of the semiconductor and related industries (LEDs, biomedical, power electronics, MEMS, displays).
• The economics of semiconductor manufacturing (which could include success with fabless or fab light, the impact of continued consolidation, how to deal with the rising costs of R&D, etc.).
• Technology trends in the semiconductor industry (450mm, continued scaling to sub–10nm, EUV and multi–patterning, FinFETs, alternatives to CMOS and optical interconnects).
• Trends in 3D Integration, TSVs, advanced packaging.
• Tips on managing 150mm and 200mm legacy fabs (adding automation and advanced process control, dealing with equipment obsolescence).
• Collaboration between fabless companies and foundries and OSATS.
• Trends in logic, memory, analog and mixed signal devices and how those are driving manufacturing requirements.
• Possibly disruptive technologies.
• New applications for semiconductors and related devices.
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| BENEFITS OF SPEAKING AT THE CONFAB
| • Present your ideas to an audience of qualified industry leaders
• Attend an executive–level conference and interact with other thought leaders and innovators
• Collaborate with material, equipment and service suppliers as well as OEM, fab, fabless and foundry manufacturers
• Attend multiple high–level networking receptions at a world–class resort | | HIGHLIGHTS FROM THE 2013 EVENT
| • The 2013 conference featured expert technology and market-related sessions from industry leaders representing: Samsung, IBM, QUALCOMM, TI and many others.
• More than 175 private meetings took place during which attendees and sponsors engaged in strategic discussions and created crucial alliances for the future.
• Attendees were top-level decision makers from organizations such as: Intel, Freescale, On Semiconductor, TSMC, GLOBALFOUNDRIES and many others.
• The 2013 event featured a record-breaking number of sponsors, including: KLA-Tencor, Applied Materials, Lam Research, Siemens and many others
• Well-attended evening receptions, breakfasts, lunches and refreshment breaks offered unparalleled networking opportunities for attendees and sponsors to meet in a relaxed environment.
SUBMIT YOUR ABSTRACT TODAY – Submission Deadline is November 22nd! http://www.theconfab.com/ | | |
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